电子百科 | 200个常用PCB专业术语中英文互译

● 安装孔 mounting hole
● 板 board
● 薄膜 thin film
● 薄膜混合电路 thin film hybrid circuit
● 薄膜开关 membrane switch
● 背板 backplane
● 背钻 back drilling
● 标志 mark
● 表面处理 surface finish
● 玻璃布 glass fabric
● 玻璃纤维 glass fiber
● 布局 placement
● 布图设计 layout
● 布线 routing
● 布线完成率 layout efficiency
● 参考基准 datum referan
● 层压 stack up
● 层压板 laminate
● 层压板面 unclad laminate surface
● 传输线 transmission line
● 单面覆铜箔层压板 single-sided copper-clad laminate
● 单面印制板 single-sided printed board (SSB)
● 导电箔 conductive foil
● 导电胶印制板 electroconductive paste printed board
● 导电图形 conductive pattern
● 导通孔 via
● 导线 conductor trace line
● 导线层 conductor layer
● 导线距离 conductor spacing
● 导线面 conductor side
● 电磁兼容性 electro-magnetic compatibility (EMC)
● 电解铜箔 electrodeposited copper foil (ED copper foil)
● 电缆 cable
● 电路模拟 circuit simulation
● 电子设计自动化 electric design automation (EDA)
● 镀通孔 plated through hole (PTH)
● 多层印制板 multilayer printed board (MLB)
● 多层印制电路板 multilayer printed circuit board
● 多层印制线路板 multilayer printed wiring board
● 多重布线印制板 multi-wiring printed board
● 非导电图形 non-conductive pattern
● 非镀通孔 non-plated through hole (NPTH)
● 非织布 non-woven fabric
● 费用矩阵 cost matrix
● 酚醛树脂 phenolic resin
● 酚醛纸质覆铜箔板 phenolic cellulose paper copper-clad laminate / phenolic/paper CCL
● 复合层压板 composite laminate
● 复合金属箔 composite metallic material
● 覆盖层 cover layer/lay
● 覆金属箔基材 metal-clad base material
● 覆铜箔层压板 copper-clad laminate (CCL)
● 刚挠多层印制板 flex-rigid multilayer printed board, rigid-flex multilayer printed board
● 刚挠双面印制板 flex-rigid double-sided printed board, rigid-flex double-sided printed board
● 刚挠印制板 flex-rigid printed board, rigid-flex printed board
● 刚性单面印制板 rigid single-sided printed board
● 刚性多层印制板 rigid multilayer printed board
● 刚性双面印制板 rigid double-sided printed board
● 刚性印制板 rigid printed board
● 高密度互连 high density interconnection
● 工程图 engineering drawing
● 功能测试 functional test
● 固化剂 curing agent
● 焊接面 solder side
● 焊盘 pad
● 厚膜 thick film
● 厚膜电路 thick film circuit
● 互连 interconnection
● 环氧玻璃布基覆铜箔板 epoxide woven glass fabric copper-clad laminate
● 环氧玻璃布纤维复合覆铜箔板 epoxide non woven/woven glass reinforced copper-clad laminate
● 环氧玻璃布纸复合覆铜箔板 epoxide cellulose paper core, glass cloth surfaces copper-clad laminate
● 环氧玻璃基板 epoxy glass substrate
● 环氧树脂 epoxy resin
● 环氧纸质覆铜箔板 epoxide cellulose paper copper-clad laminate / epoxy/paper CCL
● 回流焊接 reflow soldering
● 混合电路 hybrid circuit
● 积层多层印制板 build-up multilayer printed board (BUM)
● 积层挠性印制板 build-up flexible printed board
● 积层印制板 build-up printed board
● 基板 substrate
● 基板面 real estate
● 基材 substrate/base material
● 基膜面 base film surface
● 计算机辅助测试 computer-aided test (CAT)
● 计算机辅助工程 computer-aided engineer (CAE)
● 计算机辅助设计 computer-aided design (CAD)
● 计算机辅助制造 computer-aided manufacturing (CAM)
● 计算机集成制造 computer integrated manufacturing (CIM)
● 计算机控制显示 computer controlled display (CCD)
● 加成法用层压板 laminate for additive process
● 交互式制图设计 interactive drawing design
● 胶黏剂 adhesive
● 结晶现象 crystalline polamer
● 金手指 gold fingers
● 金属基覆铜层压板 metal base copper-clad laminate
● 金属基印制板 metal base printed board
● 金属芯覆铜箔层压板 metal core copper-clad laminate
● 金属芯印制板 metal core printed board
● 镜像 mirroring
● 聚合物 polymer
● 聚酰亚胺树脂 polyimide resin
● 聚酯薄膜 polyester
● 聚酯玻璃布覆铜箔板 polyester woven glass fabric copper-clad laminate
● 聚酯树脂 polyester resin
● 可制造性设计 design for manufacturability (DFM)
● 孔环 annular ring
● 孔密度 hole density
● 孔位 hole location
● 连接盘图形 land pattern
● 逻辑电路 logic circuit
● 逻辑模拟 logic simulation
● 逻辑设计 logic design
● 裸板 bare board
● 埋/盲孔 buried/blind via
● 埋电阻板 buried resistance board
● 埋孔 buried via (hole)
● 盲孔 blind via (hole)
● 模块化 modularization
● 模拟电路 analog circuit
● 母板 mother board
● 挠性单面印制板 flexible single-sided printed board
● 挠性多层印制板 flexible multilayer printed board
● 挠性覆铜箔绝缘薄膜 flexible copper-clad dielectric film
● 挠性双面印制板 flexible double-sided printed board
● 挠性印制板 flexible printed board
● 挠性印制电路 flexible printed circuit (FPC)
● 挠性印制线路 flexible printed wiring
● 内层芯板 core material
● 盘中孔/在连接盘中导通孔 via in pad
● 拼板 panel
● 球栅阵列 ball grid array (BGA)
● 驱动文件 drive file
● 去铜箔面 foil removal surface
● 全部钻孔 all drilled hole
● 热固性树脂 thermosetting resin
● 热塑性树脂 thermoplastic resin
● 任意层内部导通孔 any layer inner via hole (ALIVH)
● 设计规则检查 design rule checking
● 设计后处理 post design processing (PDP)
● 拾放 pick and place
● 首件 first article
● 双列直插式封装 dual in-line package (DIP)
● 双面覆铜箔层压板 double-sided copper-clad laminate
● 双面印制板 double-sided printed board (DSB)
● 丝印 silkscreen
● 陶瓷基覆铜箔板 ceramics base copper-clad laminate
● 陶瓷印制板 ceramic substrate printed board
● 铜箔 copper foil
● 铜箔面 copper-clad surface
● 图形 pattern
● 图形显示 graphics display
● 涂层；镀膜 coating
● 网格 grid
● 网络表 net list
● 微线印制板 micro wire board
● 无连接盘导通孔 landless via hole
● 细间距 fine pitch
● 线网 net
● 压延铜箔 rolled copper foil
● 引导孔 pilot hole
● 印制板 printed board
● 印制板组装 printed board assembly
● 印制板组装图 printed board assembly drawing
● 印制电路 printed circuit
● 印制电路板 printed circuit board (PCB)
● 印制电路板组装 printed circuit board assembly (PCBA)
● 印制接点 printed contact
● 印制线路 printed wiring
● 印制线路板 printed wiring board (PWB)
● 印制线路布设 printed wire layout
● 印制组件 printed component
● 优化（设计） optimization (design)
● 有源元件 active component
● 予浸材料/半固化片 prepreg
● 予浸粘结片 preimpregnated bonding sheet
● 预制内层覆箔板 mass lamination panel
● 元件编号 part number
● 原理图 schematic diagram
● 载芯片板 chip on board (COB)
● 增强板 stiffener
● 增强板材 stiffener material
● 增强材料 reinforcing material
● 粘结层 bonding layer
● 粘结膜 film adhesive
● 粘结片 bonding sheet
● 阵列 array
● 支撑孔 supported hole
● 重布 rerouting
● 装配图 assembly drawing
● 子板 daughter board
● 自动光学检测 automated optical inspection (AOI)
● 字符 legend
● 纵横比 aspect ratio
● 走（布）线器 router
● 阻焊 solder mask
● 阻燃剂 flame retardant
● 组件安置 component positioning
● 组件孔 component hole
● 组件密度 component density
● 组件面 component side
● 钻孔图 drill drawing